SANTA CLARA, Calif., Feb. 17, 2016 (GLOBE NEWSWIRE) -- Applied Micro Circuits Corporation (Nasdaq:AMCC) ("AppliedMicro") is scheduled to attend Embedded World 2016.
|WHERE:||Embedded World 2016, Nuremberg Exhibition Centre (Messezentrum 1, 90471 Nürnberg, Germany)|
|WHEN:||Tuesday, Feb. 23 - Thursday, Feb. 25, 2016|
|WHAT:||In Hall 4A Booth No. 110, AppliedMicro will showcase its industry-leading technology designed for next-generation enterprise control plane processing, wired and wireless networking, advanced storage, telecom infrastructure, and industrial applications. Attendees can view a variety of live demonstrations, partner demonstrations and displays, including the new HeliX®2 COM Express® Module developed in collaboration with Theobroma Systems.|
- Embedded World 2016 page
- HeliX™ resource page
- Theobroma Systems page
- Connect with AppliedMicro via Twitter, Facebook, LinkedIn and the Blog
Applied Micro Circuits Corporation is a global leader in computing and connectivity solutions for next-generation cloud infrastructure and data centers. AppliedMicro delivers silicon solutions that dramatically lower total cost of ownership. Corporate headquarters are located in Santa Clara, California. www.apm.com.
(C) Copyright 2016. Applied Micro Circuits Corporation, AppliedMicro, X-Gene, X-Weave, Server on a Chip, and Cloud Server are trademarks or registered trademarks of Applied Micro Circuits Corporation. All other product or service names are the property of their respective owners.
Media Contact: Applied Micro Circuits Corporation Mike Major Phone: (408) 542-8831 E-mail: firstname.lastname@example.org