“We are very excited to attract someone with Patrick’s credentials and track record to eASIC,” said Ronnie Vasishta, President and COO of eASIC. “Patrick’s executive management and operational experience will accelerate the momentum we are seeing in the adoption of our disruptive technologies, including our state-of-the-art 45nm ASIC products.”
“I am very impressed with what Ronnie and the eASIC team have achieved with the Nextreme ASIC technology. They’ve gained remarkable traction and acceptance with Tier 1 customers in a very short time-frame,” said Patrick Little, CEO of eASIC. “It’s very clear that eASIC is addressing the real cost and power challenges of our customers and making silicon customization affordable for the masses.”
“Patrick has an excellent track record of leading successful organizations that experience dramatic growth,” said Vinod Khosla, Founder of Khosla Ventures. “Patrick’s in-depth knowledge of delivering custom logic products with major Tier 1 customers will be instrumental in leading eASIC’s rapid growth.”
Little brings over 25 years of engineering, marketing, sales and general management experience in the semiconductor and consumer industries. Most recently Little was Senior Vice President of Products and Market Development at Xilinx. Over his tenure at Xilinx, Little also served as Xilinx’s Vice President and General Manager of the High Volume Products Group, Vice President and General Manager of the CPLD business unit and Corporate Vice President of Worldwide Sales & Services. Prior to Xilinx, Little served as CEO of Believe, Inc. Prior to Believe, he was Executive Vice President of Sales and Marketing at Rendition, Inc., a graphics IC company acquired by Micron Technology, Inc. Little has also served as General Manager of the consumer audio division at Diamond Multimedia Systems, Inc., and has held various management positions at Trident Microsystems, Inc., and Opti, Inc. Little began his career as a systems architect and design engineer at Wyse Technology, Inc. Little holds a BSEE from San Jose State University.
eASIC is a fabless semiconductor company offering breakthrough zero mask-charge ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing single via-layer customizable routing. This innovative fabric allows eASIC to offer ASICs with no mask-charges and no minimum order quantity,
Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Advanced Equities Incorporated and Evergreen Partners. For more information, please visit www.eASIC.com