congatec Introduces First True Extended Temperature Module Based on Intel® Atom™ Processor Z5xx Series

RadiSys Announces Cost-Effective Embedded Server Based on Intel® Multi-Core Technology

RadiSys Announces Industry’s First Fully-Integrated Embedded System for Industrial Automation Applications Built on Intel® Multi-Core Technology

New Specialized Intel® Atom™ Processor Targets Cars, Internet Phones

Intel, TSMC Reach Agreement to Collaborate on Technology Platform, IP Infrastructure, SoC Solutions

LatticeECP2M FPGA Enables Low Cost PCI Express Bridge for VOIP Platforms Based on Intel(R) Architecture

Thomas VanMatre, VP Satellogic

Yariv Geller, CEO vHive

Daryl Madden, VP Geospatial Systems Textron Systems

The OGC Blog by The Open Geospatial Consortium Blog OGC elects Dr. Zaffar Sadiq Mohamed-Ghouse to its Board of Directors

GISCafe Guest by Sanjay Gangal Autodesk Acquires Immersive Collaboration Platform, The Wild

GIS Specialist for Washington City Utah at Washington, Utah

Mechanical Engineer Advisor for Halliburton at Houston, Texas

ASIC Architects and Hardware Engineers at D. E. Shaw Research for D. E. Shaw Research at New York, New York

MECHANICAL ENGINEERING for L3Harris at Hamilton,, Canada

URISA Excellence in GIS: Restart Stark at United States - Aug 19, 2022

2022 AGIC Education & Training Symposium at United States - Aug 30 - 2, 2022

Commercial UAV Expo at Caesars Forum Las Vegas NV - Sep 6 - 9, 2022

Applanix User Group Meeting and Conference! at Fremont CA - Sep 20 - 22, 2022