The mobile industry is experiencing a convergence across the newly charted middle ground between ultra-mobile PCs and highly functional, full-featured smart phones. This blurring of the lines between these applications is driving handset manufacturers to increase storage capacity and computing power to enable integration of additional features and applications – while having to maintain a slim form factor. To do this, handset manufacturers are looking for cutting edge memory-stacking solutions that allow for the design of high-density storage directly on-board, in a single package.
Micron’s new all-in-one MCP stacks eight die to deliver an unprecedented 16GBs of available on-board storage, therefore eliminating the need for an external memory card slot. And with the space savings that the device offers—which, in some designs, could mean board-space savings of up to 40%—handset manufacturers can capitalize on greater density, yet continue to deliver sleek handset designs. Specific components of the 16GB all-in-one solution include:
With this combination of the handset’s memory and MMC controllers in a single package, Micron is enabling manufacturers to deliver optimum storage and performance. Ultimately, by aggressively applying its manufacturing and stacking prowess, Micron’s offering helps mobile designers lower cost; simplify their design process; and speed time to market with greater product connectivity, a simplified vendor list, and lower bill of materials.
“We are encouraged by the shift happening within the mobile industry, bringing with it new opportunities for memory innovations,” said Eric Spanneut, director of mobile memory marketing for Micron. “Micron has taken great strides in expanding our mobile memory portfolio and we believe we are in a unique position with our 16GB-based all-in-one solution, empowering our customers to develop original handset designs.”
“High-density, on-board storage is a critical design element for PDA phone designs, and we are impressed with the path Micron is taking for its all-in-one MCP solutions,” said Dr Alex Sun, vice president at ASUSTeK Computer, Inc. “ASUS is recognized for innovation in bridging the phone and the Internet, and with the ability to easily increase storage capacity without having to sacrifice handset form factor or performance, we see great opportunity for these solutions in our next-generation models.”
Micron is currently sampling its 16GB-based MCP solution with select mobile handset designers and will be production ready in the first quarter of 2009. Micron is also sampling 4GB and 8GB densities of the all-in-one MCP solution, which are currently qualified for commercial production.
Micron Technology, Inc. is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAMs, NAND flash memory, CMOS image sensors, other semiconductor components, and memory modules for use in leading-edge computing, consumer, networking, and mobile products. Micron’s common stock is traded on the New York Stock Exchange (NYSE) under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.
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This press release contains forward-looking statements regarding the
production of Micron’s 16GB MCP solution. Actual events or results may
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