ANSYS Accelerates Electronic Product Design And Signoff For Global Custom ASIC Leader

ANSYS' industry standard for power, noise and reliability signoff drives design optimization and closure at GUC

PITTSBURGH, Dec. 10, 2019 — (PRNewswire) —

PITTSBURGH, Dec. 10, 2019 /PRNewswire/ --  Global Unichip Corp. (GUC), the global custom application-specific integrated circuit (ASIC) leader, has adopted ANSYS (NASDAQ: ANSS) to support its unmatched combination of advanced technology, low-power and embedded CPU design capabilities.

ANSYS, Inc. logo. (PRNewsFoto/ANSYS, Inc.)

Providing advanced ASIC services that meet the needs of today's innovative technology enterprises requires a fast introduction, timely resolution to customer problems and successful signoff. GUC selected ANSYS® RedHawk-SC™ to support the significant needs of its customers by effectively executing designs with more than one billion device instances and completing the full-chip systems-on-chip (SoC) power integrity and reliability signoff in less than two days.

ANSYS RedHawk-SC is built on ANSYS® SeaScape™ — the world's first custom-designed, big data architecture for electronic system design and simulation. ANSYS SeaScape features big data architecture for electronic system design and simulation and provides elastic compute scalability to enable rapid design iteration, increased scenario coverage and greater accuracy for full-chip SoC signoff for advanced nodes. ANSYS RedHawk-SC's actionable analytics provide designers with key insights to prioritize design fixes and enable easy viewing and querying of large design databases in minutes for faster debugging. Efficient hardware utilization makes the platform ideally suited for high-performance computing, artificial intelligence and datacenter applications.   

"GUC is committed to providing world-class custom ASICs to help elevate prospective systems and integrated circuit (IC) companies' market-leading positions," said Louis Lin, senior vice president, GUC. "As IC manufacturing processes become more complex, there are more elements to simulate and compute during chip design and verification to ensure reliability and minimize power loss. ANSYS helps us minimize this complexity, speed our time to market and reduce development costs. Our partnership with ANSYS has been a cornerstone in helping our clients succeed in the IC market."

"As a custom ASIC leader, GUC requires cutting-edge solutions for fast and accurate results," said John Lee, vice president and general manager, semiconductor business unit at ANSYS. "RedHawk-SC meets the market's unique needs for addressing multiphysics challenges — we are seeing an influx of customers deploying RedHawk-SC for the most complex product and design signoff."

About ANSYS, Inc.

If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where ANSYS software played a critical role in its creation. ANSYS is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, ANSYS is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit  www.ansys.com for more information.

ANSYS and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries

ANSS-C

Contact

Media

Mary Kate Joyce



724.820.4368



marykate.joyce@ansys.com 





Investors

Annette N. Arribas, IRC



724.820.3700



annette.arribas@ansys.com 




Cision View original content to download multimedia: http://www.prnewswire.com/news-releases/ansys-accelerates-electronic-product-design-and-signoff-for-global-custom-asic-leader-300971716.html

SOURCE ANSYS, Inc.

Contact:
Company Name: ANSYS, Inc., Global Unichip Corp.
Web: http://www.ansys.com
Financial data for ANSYS, Inc., Global Unichip Corp.




Review Article Be the first to review this article
Featured Video
Latest Blog Posts
The Open Geospatial Consortium BlogThe OGC Blog
by The Open Geospatial Consortium Blog
Sponsorship Opportunities for the OGC Climate Change Services 2022 Pilot
Jobs
GIS Specialist for Schneider Geospatial at Indianapolis, Indiana
Assistant Professor in Applied GIS for University of San Diego at San Diego, California
Director, Industrial Machinery Solutions- SISW PLM for Siemens AG at Livonia, Michigan
ASIC Architects and Hardware Engineers at D. E. Shaw Research for D. E. Shaw Research at New York, New York
Product Design Engineer - Softgoods for Apple Inc at Cupertino, California
Senior Highway Engineer for RS&H at Jacksonville, Florida
Upcoming Events
GIS-Pro 2021: URISA's 59th Annual Conference at 701 Lee St #960 Des Plaines IL - Oct 3 - 6, 2021
Autodesk University 2021 | Free digital conference at United States - Oct 5 - 14, 2021
IEC 61850 Week 2021 at United Kingdom - Oct 18 - 22, 2021
Geospatial World Forum 2021 at Amsterdam Netherlands - Oct 20 - 22, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise