eSilicon Tapes Out 7nm Combo PHY (HBM2/HBM2E/Low Latency) Test Chip

SAN JOSE, Calif., May 09, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the tapeout of a 7nm test chip to provide silicon validation of its physical interface (PHY) to support the new JEDEC standard JESD235B, referred to informally as high bandwidth memory (HBM) 2E and emerging low-latency HBM technology.  The chip contains a 7nm PHY from eSilicon and a controller from Northwest Logic.  This 7nm test chip, along with a previously taped out 7nm test chip will be part of a 2.5D test system to verify end-to-end support for the new HBM interfaces. The PHY design is a “combo” device that supports HBM2, HBM2E and the emerging low-latency HBM interface in one physical IP block.

When compared to HBM2, the HBM2E standard increases total capacity from 8GB to 16GB, bandwidth per pin from 2.4 Gb/s to 3.2 Gb/s and bandwidth per stack from 307.2 GB/s to 410 GB/s. Samsung Electronics announced the industry’s first HBM2E to deliver the 3.2 Gb/s per-pin transfer speed, at NVIDIA’s GPU Technology Conference in March.

Low latency HBM devices have been launched by Renesas Electronics. These devices leverage Renesas low latency memory technology to realize high random-access rate and small data granularity as well as high bandwidth for latency-sensitive applications.

“We are pleased to work with our partner, eSilicon, on the validation of our Controller for HBM2E and low latency applications,” said Brian Daellenbach, president of Northwest Logic. “This validation further strengthens our industry-leading HBM2 Controller solution.”

“HBM memory stacks are a critical component for many of our new FinFET-class 2.5D ASICs,” said Hugh Durdan, vice president, strategy and products at eSilicon. “We look forward to validating the performance and functionality of our combo PHY and Northwest Logic’s controller to support the latest HBM capabilities.”

You can learn more about eSilicon’s 7nm IP platform here, or contact your eSilicon sales representative directly or via sales@esilicon.com. You can learn more about Northwest Logic’s HBM2 Controller Cores here.

About e Silicon
eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 56G/112G SerDes plus networking-optimized 16/14/7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialized memory compilers and I/O libraries. Our neuASIC™ platform provides AI-specific IP and a modular design methodology to create adaptable, highly efficient AI ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets. www.esilicon.com

Collaborate. Differentiate. Win.™

eSilicon is a registered trademark, and the eSilicon logo, neuASIC and “Collaborate. Differentiate. Win.” are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.

Contacts: 
Sally SlemonsNanette Collins
eSilicon CorporationPublic Relations for eSilicon
Email Contact  Email Contact 

eSilicon.jpg




Review Article Be the first to review this article
Featured Video
Latest Blog Posts
The Open Geospatial Consortium BlogThe OGC Blog
by The Open Geospatial Consortium Blog
Sponsorship Opportunities for the OGC Climate Change Services 2022 Pilot
Jobs
Assistant Professor in Applied GIS for University of San Diego at San Diego, California
GIS Specialist for Schneider Geospatial at Indianapolis, Indiana
Senior Highway Engineer for RS&H at Jacksonville, Florida
ASIC Architects and Hardware Engineers at D. E. Shaw Research for D. E. Shaw Research at New York, New York
Director, Industrial Machinery Solutions- SISW PLM for Siemens AG at Livonia, Michigan
Product Design Engineer - Softgoods for Apple Inc at Cupertino, California
Upcoming Events
GIS-Pro 2021: URISA's 59th Annual Conference at 701 Lee St #960 Des Plaines IL - Oct 3 - 6, 2021
Autodesk University 2021 | Free digital conference at United States - Oct 5 - 14, 2021
IEC 61850 Week 2021 at United Kingdom - Oct 18 - 22, 2021
Geospatial World Forum 2021 at Amsterdam Netherlands - Oct 20 - 22, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise