DesignCon 2019: eSilicon to demonstrate 7nm 56G DSP SerDes over 5-meter Samtec cable assembly

SAN JOSE, Calif., Jan. 23, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will team up with Samtec to demonstrate eSilicon’s 7nm 56G full-DSP SerDes over Samtec’s 5m ExaMAX® Backplane Cable Assembly.

eSilicon will also participate in Test Fixture Signal Integrity for 112G PAM-4: Lively Panel Discussion on the Top Design Rules.

SerDes Demonstrations: Samtec Booth 737
Wednesday-Thursday
January 30-31, 2019

Using Samtec ExaMAX Backplane Connector paddle cards and a 5m ExaMAX Backplane Cable Assembly, eSilicon will demonstrate the performance, flexibility and extremely low power consumption of its 7nm, 56G PAM4 and NRZ DSP-based long-reach SerDes.

Forward error correction (FEC)-free operation will be showcased across multiple channels, operation frequencies and modulation schemes, thanks to a very powerful and programmable real-time DSP-based equalization capability. Bit-error rate, eye diagram monitors and pulse response processing will be shown among many other capabilities.

Panel Discussion:
Test Fixture Signal Integrity for 112G PAM-4: Lively Panel Discussion on the Top Design Rules
Wednesday, January 30
10:00-10:45 AM
Panelists: Tim Horel, eSilicon; Scott McMorrow, Samtec; Al Neves, Wild River; Heidi Barnes, Keysight; Jason Ellison, Amphenol.

About DesignCon
January 29-31, 2019
Santa Clara convention Center
Santa Clara, Calif.

As the nation’s largest event for chip, board, and systems designers, DesignCon is a must-attend opportunity to share ideas, overcome challenges, and source solutions.

About eSilicon
eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 56G/112G SerDes plus networking-optimized 16/14/7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialized memory compilers and I/O libraries. Our neuASIC™ platform provides AI-specific IP and a modular design methodology to create adaptable, highly efficient AI ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, artificial intelligence (AI) and 5G infrastructure markets. www.esilicon.com

Collaborate. Differentiate. Win.™

eSilicon is a registered trademark, and the eSilicon logo, neuASIC andCollaborate. Differentiate. Win.” are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.

Contacts:
Sally Slemons
eSilicon Corporation
408-635-6409
sslemons@esilicon.com

Nanette Collins
Public Relations for eSilicon
617-437-1822
nanette@nvc.com

eSilicon.jpg




Review Article Be the first to review this article
Featured Video
Jobs
GIS Coordinator for City of Marysville at Marysville, Ohio
GIS Analyst II for Foresters Co Op at Grass Valley, California
GIS Server Administrator (GIS Developer) for Seminole County Government at Sanford, Florida
Geospatial Solutions Specialist for University of North Dakota at Grand Forks, North Dakota
BIM/CAD Specialist for Gordon Prill, Inc at Sunnyvale, California
Senior Highway Engineer for RS&H at Jacksonville, Florida
Upcoming Events
InterDrone 2021 --- Cancelled at Hyatt Regency Dallas TX - Aug 10 - 12, 2021
URISA GIS Leadership Academy at 701 Lee St #960 Des Plaines IL - Aug 16 - 20, 2021
8th International Scientific Conference on SOCIAL SCIENCES (ISCSS) 2021 at Congress Centre MARITIM PARADISE BLUE Albena Bulgaria - Aug 21 - 30, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise