Advanced Semiconductor Manufacturing: ASMC 2019 Call for Papers Deadline is October 9, 2018

Educate the industry about the latest in advanced processes and materials

MILPITAS, Calif. – Sept. 7, 2018 – SEMI announced today the October 9 deadline for presenters to submit abstracts for the annual SEMI  Advanced Semiconductor Manufacturing Conference(ASMC). ASMC, May 6-9, 2019, in Saratoga Springs, New York, will feature technical presentations of more than 90 peer-reviewed manuscripts covering critical process technologies and fab productivity.

ASMC 2019 will feature keynotes, a panel discussion, networking events, technical sessions on advanced semiconductor manufacturing, and tutorials. The conference will also feature a special student poster session to highlight student projects related to semiconductor manufacturing.

Selected speakers will present to IC manufacturers, equipment manufacturers, materials suppliers, chief technology officers, operations managers, process engineers, product managers and academia. All technical papers will be published by IEEE, and authors also may receive an invitation to publish their papers in a special section for ASMC 2019 to be featured in IEEE Transactions on Semiconductor Manufacturing.  Technical abstracts are due October 9, 2018, and can be submitted  here

ASMC 2019 will cover the following topics:

  • Advanced Equipment Processes and Materials
  • Advanced Metrology
  • Advanced Equipment Processes and Materials
  • Advanced Patterning / Design for Manufacturability
  • Advanced Process Control
  • Contamination Free Manufacturing
  • Big Data Management and Mining
  • Defect Inspection and Reduction
  • Discrete and Power Devices
  • Enabling Technologies and Innovative Devices
  • Equipment Reliability and Productivity Enhancements
  • Factory Automation
  • The Fabless Experience
  • Green Factory
  • Industrial Engineering
  • Lean Manufacturing
  • MOL and Junction Interfaces
  • Smart Manufacturing
  • Yield Enhancement/Learning
  • Yield Methodologies
  • 3D Packaging and Through Silicon Via

ASMC, in its 30th year, continues to fill a critical need for the industry, providing a venue for professionals to network, learn and share knowledge about semiconductor manufacturing best practices. 

Details on how to upload abstracts can be found  hereTo learn more about the conference and the selection process, please contact Margaret Kindling at  Email Contact or call 1.202.393.5552.    

Papers co-authored by device manufacturers, equipment or materials suppliers, and/or academic institutions that demonstrate innovative, practical solutions for advancing semiconductor manufacturing are highly encouraged.  

ASMC  is organized by SEMI Americas to connect more than  2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing.


SEMI Americas
Email Contact

Review Article Be the first to review this article
Featured Video
Assistant Professor in Applied GIS for University of San Diego at San Diego, California
GIS Specialist for Schneider Geospatial at Indianapolis, Indiana
BIM/VDC Coordinator for MBH Architects at Alameda, California
Director, Industrial Machinery Solutions- SISW PLM for Siemens AG at Livonia, Michigan
Product Design Engineer - Softgoods for Apple Inc at Cupertino, California
ASIC Architects and Hardware Engineers at D. E. Shaw Research for D. E. Shaw Research at New York, New York
Upcoming Events
HxGN LIVE GeoSummit 2021 at Virtual Event - Sep 21 - 23, 2021
INTERGEO 2021 at Hannover Germany - Sep 21 - 23, 2021
Automotive LIDAR 2021 at Online Only - Sep 21 - 23, 2021

© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise