Global Semiconductor Leader HiSilicon Leverages ANSYS To Drive Product Innovation

Multiyear agreement on power integrity and reliability analysis drives 10x faster runtime and innovation across 5G and other connected devices

PITTSBURGH, Aug. 6, 2018 — (PRNewswire) —

PITTSBURGH, Aug. 6, 2018 /PRNewswire/  -- By broadly applying ANSYS (NASDAQ: ANSS) solutions to power integrity and reliability analysis, global semiconductor leader HiSilicon Technologies Co., a wholly owned subsidiary of Huawei Technologies Co., Ltd., is driving new levels of innovation into the next generation of mobile, networking, artificial intelligence and 5G products.

ANSYS, Inc. logo. (PRNewsFoto/ANSYS, Inc.)

Through a multiyear agreement, the global fabless semiconductor company is relying on ANSYS' suite of semiconductor and electronics simulation solutions for power integrity and reliability signoff to address complex multiphysics challenges such as on-chip thermal effects, aging, thermal-aware statistical electromigration (EM) budgeting, electrostatic discharge (ESD), as well as creation of chip power models for simulating the entire package and system. Additionally, HiSilicon is using ANSYS® RedHawk-SC™ as its next generation power-integrity and reliability signoff solution to enable the design success for all advanced process nodes including 7nm and 5nm.

"The large design size and advanced process technologies for next-generation chips are creating unprecedented challenges in power integrity," said Catherine Xia, head of Platform Department, HiSilicon. "Despite these issues, ANSYS solutions like RedHawk-SC are returning results that are more than 10x faster in runtime, 15x smaller in memory requirements and greater accuracy than previous versions of RedHawk and really helps us to drive innovation for our global customers." ­­

"As one of the market leaders in semiconductor technology trying to tackle the industry's greatest challenges, HiSilicon requires the most modern solutions to deliver fast, accurate results," said John Lee, vice president and general manager, ANSYS. "RedHawk-SC, the first purpose-built, big data architecture for electronic system design and simulation, does just that. In fact, all of our 7-nanometer RedHawk customers are using or deploying RedHawk-SC for signoff of their most complex products and designs."

About ANSYS, Inc.

If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where ANSYS software played a critical role in its creation. ANSYS is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, ANSYS is headquartered south of Pittsburgh, Pennsylvania, U.S.A., Visit for more information.

ANSYS and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.





Amy Pietzak




Annette Arribas




Cision View original content with multimedia:


Company Name: ANSYS, Inc., HiSilicon Technologies Co.
Financial data for ANSYS, Inc., HiSilicon Technologies Co.


Review Article Be the first to review this article
Featured Video
Latest Blog Posts
The Open Geospatial Consortium BlogThe OGC Blog
by The Open Geospatial Consortium Blog
OGC seeks public comment on draft Simple Features 2021 standard
Geospatial Solutions Specialist for University of North Dakota at Grand Forks, North Dakota
GIS Coordinator for City of Marysville at Marysville, Ohio
GIS Analyst II for Foresters Co Op at Grass Valley, California
Construction Project Manager for Gordon Prill, Inc at Sunnyvale, California
Product Design Engineer - Softgoods for Apple Inc at Cupertino, California
Electrical Designer for Dinter Engineering at Reno, Nevada
Upcoming Events
InterDrone 2021 --- Cancelled at Hyatt Regency Dallas TX - Aug 10 - 12, 2021
URISA GIS Leadership Academy at 701 Lee St #960 Des Plaines IL - Aug 16 - 20, 2021
8th International Scientific Conference on SOCIAL SCIENCES (ISCSS) 2021 at Congress Centre MARITIM PARADISE BLUE Albena Bulgaria - Aug 21 - 30, 2021

© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise