TE Connectivity introduces Extra Large Array (XLA) socket technology for next-gen data centers

Solution offers superior warpage control and enables faster data rates

HARRISBURG, Pa., June 26, 2018 — (PRNewswire) —  TE Connectivity (TE), a world leader in connectivity and sensors, today introduced its new extra-large array (XLA) socket technology, which provides more reliable performance with 78 percent better warpage control than traditional molded socket technologies. The XLA socket technology allows TE to design enhanced sockets to support high data speeds in next-generation data centers.

TE Connectivity's extra-large array (XLA) socket technology provides more reliable performance with 78 percent better warpage control than traditional molded socket technologies

The utilization of printed circuit board (PCB) substrates versus other plastic materials results in minimal warpage and enables TE to design the industry's largest one-piece socket with sizes up to 110mm x 110mm and a 10,000+ position count capability. Because of such large capacity, these sockets are capable of extremely fast data rates up to 56Gbps.

"TE's XLA socket technology provides the ability to scale to extremely high pin counts, staying ahead of market demand for next-generation switches and servers," says Erin Byrne, Vice President, Engineering and Chief Technical Officer for Data & Devices at TE Connectivity. "The XLA socket will enable the expansion in scale and performance needed for future high-performance computing and processing."

XLA socket technology also offers 33 percent improved true position on the solder ball and contact, low coefficient of thermal expansion (CTE) mismatch to motherboard, and mitigates SMT risks during customer application. Two versions are available: the hybrid land grid array/ball grid array (LGA/BGA) and the dual compression LGA/BGA.

To learn more about TE's new XLA socket technology, click here.

TE Connectivity Ltd. is a $13 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 78,000 employees, including more than 7,000 engineers, working alongside customers in nearly 150 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Twitter.

TE Connectivity, TE, TE connectivity (logo), and EVERY CONNECTION COUNTS are trademarks of the TE Connectivity Ltd. family of companies. 
Other products, logos, and/or company names mentioned herein may be trademarks of their respective owners.


TE Connectivity Ltd. Logo. (PRNewsfoto/TE Connectivity)

Cision View original content with multimedia: http://www.prnewswire.com/news-releases/te-connectivity-introduces-extra-large-array-xla-socket-technology-for-next-gen-data-centers-300672153.html

SOURCE TE Connectivity

Company Name: TE Connectivity
Lauren Brekosky, TE Connectivity, 717-986-7342
Email Contact
Web: http://www.te.com

Review Article Be the first to review this article

Featured Video
Latest Blog Posts
The Open Geospatial Consortium BlogThe OGC Blog
by The Open Geospatial Consortium Blog
OGC appoints three new members to its Board of Directors
GIS Manager for Union County NC at Monroe, California
GIS Supervisor for Sanborn at Colorado Springs, Colorado
Manager, Remote Sensing Sales for One-Compass Suite of Companies at Denver, Colorado
Assistant Engineer. for Alameda County CA at Oakland, California
GIS Analyst for Union County NC at Monroe, California
Marketing Associate for One-Compass Suite of Companies at Denver, Colorado
Upcoming Events
GEO Business at ExCel London United Kingdom - May 19 - 20, 2021
FOSSGIS-Konferenz 2021 at OST - Ostschweizer Fachhochschule Campus Rapperswil Oberseestrasse 10 Rapperswil Switzerland - Jun 6 - 9, 2021
GI_Forum 2021 | re.connecting spatially at Salzburg Austria - Jul 5 - 9, 2021
InterDrone 2021 at Hyatt Regency Dallas TX - Aug 10 - 12, 2021
University of Denver GIS Masters Degree Online
UAV Expo2021 -Register   & save

© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise