Global Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market (2018-2023) - Samsung, Micron, SK Hynix, Intel, and AMD are Dominating the Market

DUBLIN, March 12, 2018 — (PRNewswire) —

The "Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market by Memory Type (HMC and HBM), Product type (GPU, CPU, APU, FPGA, ASIC), Application, and Geography - Global Forecast to 2023" report has been added to ResearchAndMarkets.com's offering.

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The market for HMC and HBM is likely to be valued at USD 922.7 million in 2018 and USD 3,842.5 million by 2023, at a CAGR of 33.02% between 2018 and 2023.

The factors that drive the market growth include the growing need for high-bandwidth, low power consuming, and highly scalable memories; increasing adoption of artificial intelligence; and rising trend of miniaturization of electronic devices. However, thermal issues caused by high level of integration restrict the growth of the HMC and HBM market.

Currently, the major application of HBM is graphics. With improved specifications, HBM has started gaining traction in high-performance computing, cloud computing, and networking; the adoption of the HBM technology in these applications is further expected to increase in the coming years. Moreover, HBM is priced at a lower cost than HMC; this has encouraged companies to integrate HBM in their high-end products.

The high market share of CPUs is due to their significant adoption in high-performance computing, especially in data centers. HMCs have been developed for this particular application to support advanced and intensive real-time operation. CPU plays a critical role in deterring how content can be handled. More the applications and content utility more processing capability is required in CPU. Therefore, advanced CPUs widely adopt the HMC and HBM technology to increase the performance of CPUs for servers rather than increasing the number of CPUs. The leading player in the CPU market, Intel (US) offers processors with inbuilt HMC, serving a large market of HPC and data centers.

A majority of the products available in the market with the HBM technology are GPU products. HBM was initially adopted in GPUs specifically for graphics applications. For instance, AMD (US) developed the HBM technology along with SK Hynix (South Korea) to be used in GPUs. Along with GPUs, APUs have also been introduced in the market that are increasingly being used for gaming applications. The increasing adoption of HMC and HBM in gaming is largely due to the increasing requirements to process more pixels for larger screens and support higher compute rates for more stabilization to support high-end gaming.

The high adoption of HMC and HBM memories in North America is largely attributed to the growth in high-performance computing (HPC) applications that require high-bandwidth memory solutions for fast data processing. The demand for HPC in North America is growing owing to the increasing market for AI, machine learning, and cloud computing. In addition, major HPC-based CPU and processor providers, such as Intel, are based in North American countries. Other key tech companies such as Google, Amazon, and Microsoft are headquartered in the US and have served to drive the demand for high-performing CPUs in servers and supercomputers.

Key players in the HMC and HBM market include Samsung (South Korea), Micron (US), SK Hynix (South Korea), Intel (US), and AMD (US). Samsung has been at the top position because of its wide contribution to the parent market share and high financial power. The company's strong market position, coupled with strong brand equity, imparts a significant competitive edge. The company is part of the hybrid memory cube consortium and has begun the mass production of its high-bandwidth memory for computing, enterprise servers and advanced graphics, and network systems.

Market Dynamics

Drivers

  • Growing Need for High-Bandwidth, Low Power Consuming, and Highly Scalable Memories
  • Increasing Adoption of Artificial Intelligence
  • Rising Trend of Miniaturization of Electronic Devices

Restraints

  • Thermal Issues Caused By High Levels of Integration

Opportunities

  • High Demand for Cloud-Based Services
  • Growing Big Data

Challenges

  • Design Complexities Associated With HMC and HBM
  • Ecosystem Development

Key Topics Covered:

1 Introduction

2 Research Methodology

3 Executive Summary

4 Premium Insights

5 Market Overview

6 HMC and HBM Market, by Memory Type

7 HMC and HBM Market, by Product Type

8 HMC and HBM Market, by Application

9 Geographic Analysis

10 Competitive Landscape

11 Company Profiles

  • Advanced Micro Devices
  • Arira
  • Arm
  • Cadence
  • Cray
  • Fujitsu
  • IBM
  • Intel
  • Marvell
  • Micron
  • Nvidia
  • Open-Silicon
  • Rambus
  • Samsung
  • SK Hynix
  • Xilinx

For more information about this report visit https://www.researchandmarkets.com/research/5cwh7b/global_hybrid?w=5

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