TE Connectivity enables future of 400GbE at DesignCon 2018

OSFP, QSFP-DD products support emerging ethernet standard

HARRISBURG, Pa., Jan. 31, 2018 — (PRNewswire) — TE Connectivity (TE), a world leader in connectivity and sensors, today announced the showcasing of OSFP and QSFP-DD connectivity products at this year's DesignCon show that will soon enable 400-Gigabit Ethernet in a range of data center devices. TE will demonstrate the new products in booth 817 at the DesignCon 2018 expo on January 31-February 1 in Santa Clara, California.

TE Connectivity Ltd. Logo. (PRNewsfoto/TE Connectivity)

Targeted for massive aggregation of data across an array of applications, 400 Gigabit Ethernet (GbE) has completed the standardization process and was published in December 2017 by the IEEE 802.3bs Ethernet Working Group. Development of new and faster electrical and optical signaling technologies is simultaneously underway across the ever-expanding Ethernet ecosystem.  

The QSFP form factor is today's industry workhorse for delivering 40 and 100GbE. The "Q" is for "quad" — a nod to the four-channel electrical interface, with each lane running at 25 Gbps for 100GbE. TE's QSFP-DD connector adopts the same basic concept as its predecessor, but doubles the electrical contact density, via eight differential pairs capable of 50 Gbps each, to achieve 400GbE while allowing existing QSFP modules to be plugged into the same cage. 

The OSFP form factor is designed for maximum thermal and electrical performance, but does not provide backwards compatibility to existing form factors without an adapter. The "O" is for "octal" — it is being designed to use eight electrical lanes to deliver 400GbE — and "SFP" is for "small form factor pluggable.  

"At TE, we are focused on delivering products that make our world smarter, faster and more connected. Our OSFP and QSFP-DD products bring data center equipment into the 400GbE age," said Nathan Tracy, technologist for TE's system architecture team and manager of industry standards. "By giving customers a choice between fully-optimized thermal performance and backward compatibility with existing QSFP connectors, we support the complete range of 400GbE solutions for system designers."

To learn more about TE's live demonstrations at DesignCon or schedule an on-site meeting, visit our DesignCon 2018 events page.  

TE Connectivity Ltd. (NYSE: TEL) is a $13 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 78,000 employees, including more than 7,000 engineers, working alongside customers in nearly 150 countries, TE ensures that EVERY CONNECTION COUNTS

Learn more at www.te.com and on LinkedIn, FacebookWeChat and  Twitter.  

TE Connectivity, TE, TE connectivity (logo), and EVERY CONNECTION COUNTS are trademarks of the TE Connectivity Ltd. family of companies. 
Other logos, product(s) and/or company names might be trademarks of their respective owners.  


Cision View original content with multimedia: http://www.prnewswire.com/news-releases/te-connectivity-enables-future-of-400gbe-at-designcon-2018-300591262.html

SOURCE TE Connectivity

Company Name: TE Connectivity, DesignCon
Media Relations Contact: Megan Veres, TE Connectivity, 717-986-7227
Email Contact
Web: http://www.te.com

Review Article Be the first to review this article

Featured Video
GIS Manager for City of Vancouver at Vancouver, Washington
Geospatial Mapping Training and Support Specialist for Duncan-Parnell Inc. at Morrisville, North Carolina
US-Based Geospatial Software Sales Representative for Kongsberg Geospatial at Ottawa, Any State in the USA
GPS and Mobile GIS Sales Development for Duncan-Parnell Inc. at Charlotte, North Carolina
GIS Analyst for County of Bernalillo at Albuquerque, NM, New Mexico
Regional Sales Manager (Eastern North America) for Teledyne Optech at Kiln, Mississippi
Upcoming Events
GI_Forum 2021 | re.connecting spatially at Salzburg Austria - Jul 5 - 9, 2021
InterDrone 2021 at Hyatt Regency Dallas TX - Aug 10 - 12, 2021
URISA GIS Leadership Academy at 701 Lee St #960 Des Plaines IL - Aug 16 - 20, 2021
8th International Scientific Conference on SOCIAL SCIENCES (ISCSS) 2021 at Congress Centre MARITIM PARADISE BLUE Albena Bulgaria - Aug 21 - 30, 2021
University of Denver GIS Masters Degree Online
UAV Expo2021 -Register   & save

© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise