Toshiba Memory America Adds UFS to Lineup of Embedded NAND Flash Memory Products for Automotive Applications

Addresses Data Storage Demands of Increasingly Complex Applications Including Automotive Entertainment & Information Systems and ADAS

SAN JOSE, Calif. — (BUSINESS WIRE) — December 13, 2017Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation and the maker of the industry’s first Universal Flash Storage (UFS) devices[1], today announced that it has begun the sampling of new Automotive UFS (JEDEC ver. 2.1 HS-G3) embedded memory solutions. TMA’s Automotive UFS supports a wide temperature range (-40°C to +105°C), meets AEC-Q100 Grade2[2] requirements and offers enhanced reliability capabilities that increasingly complex automotive applications require. The lineup consists of a wide range of capacities: 16GB, 32GB, 64GB, 128GB, and 256GB.

This press release features multimedia. View the full release here: http://www.businesswire.com/news/home/20171213005281/en/

Toshiba’s new Automotive UFS supports a wide temperature range, meets AEC-Q100 Grade2 requirements a ...

Toshiba’s new Automotive UFS supports a wide temperature range, meets AEC-Q100 Grade2 requirements and offers the performance, reliability and density required by increasingly complex automotive applications.(Graphic: Business Wire)

The addition of Automotive UFS expands TMA’s lineup of embedded NAND flash memory products for automotive applications – joining its Automotive e-MMC[3] family. The storage requirements for automotive applications continue to increase as entertainment & information systems and ADAS[4] in cars become more sophisticated. UFS is well-suited to support the high-performance and density needs of these applications.

"Automotive storage requirements continue to expand across a variety of applications within the vehicle as they become more autonomous,” said Gregory Wong, president, Forward Insights. “This includes the memory used for ADAS recognition and decision components, V2X components, infotainment and clusters. Toshiba's broad density lineup of high-speed UFS memory for automotive is perfectly positioned to support this trend."

TMA’s new Automotive UFS devices are based on the company's 15nm process technology. By utilizing the UFS interface, significantly higher performance than Automotive e-MMC is realized. For example, sequential read is 2.7 times, sequential write is 1.1 times, random read is 7 times, and random write is 4.4 times faster (approximately) than Automotive e-MMC[5].

“Our UFS for consumer applications boosts overall system performance in mobile devices, and the introduction of Automotive UFS will have a similarly positive impact on the development of in-vehicle infotainment and ADAS systems,” noted Scott Beekman, director of managed flash memory products for TMA. “As the storage requirements for automotive applications continue to accelerate, Toshiba will continue to lead the market forward by reinforcing our lineup of high-performance, high-density memory solutions targeted to the automotive sector.”

Several new functions have been added to Automotive UFS, such as Refresh, Thermal Control and Extended Diagnosis, which are well-suited to the requirements of automotive applications. The Refresh function can be used to refresh data stored in UFS and helps to extend the data’s lifespan. The Thermal Control function protects the device from overheating in high-temperature circumstances that can occur in automotive applications. Lastly, the Extended Diagnosis function helps users easily understand the device’s status.

Lineup of the New Products

Product Name       Capacity       Temperature Range       Package       Sampling Start Time
THGAF9G7L1LBAB7       16GB       -40℃~+105℃       11.5x13.0x1.0mm       Dec. 2017
THGAF9G8L2LBAB7       32GB       -40℃~+105℃       11.5x13.0x1.0mm       Dec. 2017
THGAF9G9L4LBAB8       64GB       -40℃~+105℃       11.5x13.0x1.2mm       Dec. 2017
THGAF9T0L8LBAB8       128GB       -40℃~+105℃       11.5x13.0x1.2mm       Dec. 2017
THGAF9T1LBLBABY       256GB       -40℃~+105℃       12.0x16.0x1.6mm       2Q, 2018 (Apr.-Jun.)
                       

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