Toshiba Expands Line-up of Embedded NAND Flash Memory Products for Automotive Applications

- Supports AEC-Q100 Grade2 Requirements -

TOKYO — (BUSINESS WIRE) — December 20, 2016Toshiba Corporation’s (TOKYO: 6502) Storage & Electronic Devices Solutions Company today announced the launch of JEDEC e∙MMCTM Version 5.1[1] compliant embedded NAND flash memory products supporting AEC-Q100 Grade2 [2] requirements. The line-up offers densities of 8GB, 16GB, 32GB and 64GB. Sample shipments start from today with mass production scheduled for the second quarter (April to June) of 2017.

This Smart News Release features multimedia. View the full release here: http://www.businesswire.com/news/home/20161220005388/en/

Toshiba: e-MMC embedded NAND flash memory product for automotive applications supporting AEC-Q100 Gr ...

Toshiba: e-MMC embedded NAND flash memory product for automotive applications supporting AEC-Q100 Grade2 requirements (Photo: Business Wire)

The new products integrate NAND chips fabricated with 15nm process technology with a controller to manage basic control functions for NAND applications in a single package. As a complement to Toshiba’s previous product group of e∙MMC, which deliver the operating temperature range of -40 to +85°C required by car infotainment applications, the new products support applications such as instrument clusters that require e∙MMC storage solutions to operate at higher temperatures up to +105°C.

In the automotive market, demand for NAND flash memory is continuing to grow alongside advances in car infotainment, ADAS [3] and autonomous driving systems. Toshiba is meeting this demand by reinforcing its line-up of high performance and high density memory products and will continue to take leadership in the market.

Toshiba is also developing automotive UFS [4] products that support AEC-Q100.

 

New Product Line-up

 
Part Number   Capacity   Temperature Range   Package
THGBMHG6C1LBAB6 8GB

-40℃ to +105℃

11.5x13x0.8mm
THGBMHG7C2LBAB7 16GB

-40℃ to +105℃

11.5x13x1.0mm
THGBMHG8C4LBAB7 32GB

-40℃ to +105℃

11.5x13x1.0mm
THGBMHG9C8LBAB8   64GB  

-40℃ to +105℃

  11.5x13x1.2mm
 

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