REMINDER - MEDIA ALERT: ESD Alliance Executive Director to Address ARM TechCon Attendees With Presentation Titled "Semiconductor IP and the Impact of Multi-Die IC Design"

SAN JOSE, CA -- (Marketwired) -- Oct 25, 2016 --


WHO: Bob Smith, executive director of the Electronic System Design Alliance (ESD Alliance), an international association of companies providing goods and services throughout the semiconductor design ecosystem

WHAT: Will present "Semiconductor intellectual property (SIP) and the Impact of Multi-Die integrated circuit (IC) Design" during ARM TechCon. The ESD Alliance will exhibit in Booth #523 to showcase its programs, new initiatives and growing list of member companies.

WHEN: Smith's presentation will be held Thursday, October 27, from 3:30 p.m. until 4:20 p.m. in Ballroom D. ARM TechCon's Expo Hall will be open Wednesday, October 26, from 10:30 a.m. until 6:30 p.m. and Thursday, October 27, from 10:30 a.m. until 6:30 p.m.

WHERE: Santa Clara Convention Center, Santa Clara, Calif.

Smith's talk will address emerging trends in the new wave of multi-die IC design and how that is driving strategic changes in the SIP market. He will outline the industry's move from transistor integration to functional integration, why SIP will play a greater role than it currently does and how this benefits IP vendors and users.

To learn more about the ESD Alliance, go to: www.esd-alliance.org

Information about ARM TechCon can be found at: www.armtechcon.com

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, an international association of companies providing goods and services throughout the semiconductor design ecosystem, is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design industry as a vital component of the global electronics industry. For more information about the ESD Alliance, visit http://www.esd-alliance.org

All trademarks and registered trademarks are the property of their respective owners.

For more information, contact:
Nanette Collins
Public Relations for the ESD Alliance
(617) 437-1822

Email Contact 





Review Article Be the first to review this article
Featured Video
Jobs
GIS Specialist for Schneider Geospatial at Indianapolis, Indiana
Assistant Professor in Applied GIS for University of San Diego at San Diego, California
Director, Industrial Machinery Solutions- SISW PLM for Siemens AG at Livonia, Michigan
ASIC Architects and Hardware Engineers at D. E. Shaw Research for D. E. Shaw Research at New York, New York
Product Design Engineer - Softgoods for Apple Inc at Cupertino, California
Senior Highway Engineer for RS&H at Jacksonville, Florida
Upcoming Events
HxGN LIVE GeoSummit 2021 at Virtual Event - Sep 21 - 23, 2021
INTERGEO 2021 at Hannover Germany - Sep 21 - 23, 2021
Automotive LIDAR 2021 at Online Only - Sep 21 - 23, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise