eSilicon to present proven HBM/2.5D solutions at TSMC OIP Ecosystem Forum China 2016

SAN JOSE, CA--(Marketwired - October 20, 2016) - eSilicon, a leading semiconductor design and manufacturing solutions provider, will present Enabling the Expanding Cloud: High-Bandwidth Memory and 2.5D Solutions at the TSMC OIP Ecosystem Forum China 2016.

What:
The next generation of high-performance computing, graphics and networking applications have increasing needs for bandwidth. High-bandwidth memory (HBM) combined with 2.5D technology offers a tremendous increase in capacity and performance. Increased capacity because of the stacked memory in a smaller area and increased performance because of the interposer and shorter signal routing. The interposer allows the integration of highly parallel connections to the memory stacks inside the package, therefore it is able to offer huge capacity and performance increases.

This presentation will highlight the silicon characteristics of eSilicon's HBM Gen2 PHY in TSMC's CLN28HPC technology. The presentation will also highlight TSMC CoWoS technology as well as complex ASICs that use HBM and 2.5D technologies.

Who:
Chris Wu, eSilicon IP Sales Director, APAC

When:
October 25, 2016

Where:
Shangri-La Hotel Beijing
29 Zizhuyuan Road
Beijing 100089 China




Contacts: 

Sally Slemons 
eSilicon Corporation 
408-635-6409 

Email contact


Susan Cain Cain Communications 408-393-4794 Email contact




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