eSilicon to present proven HBM/2.5D solutions at TSMC OIP Ecosystem Forum China 2016

SAN JOSE, CA--(Marketwired - October 20, 2016) - eSilicon, a leading semiconductor design and manufacturing solutions provider, will present Enabling the Expanding Cloud: High-Bandwidth Memory and 2.5D Solutions at the TSMC OIP Ecosystem Forum China 2016.

What:
The next generation of high-performance computing, graphics and networking applications have increasing needs for bandwidth. High-bandwidth memory (HBM) combined with 2.5D technology offers a tremendous increase in capacity and performance. Increased capacity because of the stacked memory in a smaller area and increased performance because of the interposer and shorter signal routing. The interposer allows the integration of highly parallel connections to the memory stacks inside the package, therefore it is able to offer huge capacity and performance increases.

This presentation will highlight the silicon characteristics of eSilicon's HBM Gen2 PHY in TSMC's CLN28HPC technology. The presentation will also highlight TSMC CoWoS technology as well as complex ASICs that use HBM and 2.5D technologies.

Who:
Chris Wu, eSilicon IP Sales Director, APAC

When:
October 25, 2016

Where:
Shangri-La Hotel Beijing
29 Zizhuyuan Road
Beijing 100089 China




Contacts: 

Sally Slemons 
eSilicon Corporation 
408-635-6409 

Email contact


Susan Cain Cain Communications 408-393-4794 Email contact




Review Article Be the first to review this article


Featured Video
Jobs
Engineer III - Hydraulics for State of Nebraska at Lincoln, California
Regional Sales Manager (Eastern North America) for Teledyne Optech at Kiln, Mississippi
Geospatial Mapping Training and Support Specialist for Duncan-Parnell Inc. at Morrisville, North Carolina
GIS Sales and Business Development for Duncan-Parnell Inc. at Ashland, Virginia
GIS Manager for City of Vancouver at Vancouver, Washington
GIS Analyst for County of Bernalillo at Albuquerque, NM, New Mexico
Upcoming Events
GI_Forum 2021 | re.connecting spatially at Salzburg Austria - Jul 5 - 9, 2021
InterDrone 2021 at Hyatt Regency Dallas TX - Aug 10 - 12, 2021
URISA GIS Leadership Academy at 701 Lee St #960 Des Plaines IL - Aug 16 - 20, 2021
8th International Scientific Conference on SOCIAL SCIENCES (ISCSS) 2021 at Congress Centre MARITIM PARADISE BLUE Albena Bulgaria - Aug 21 - 30, 2021
University of Denver GIS Masters Degree Online
UAV Expo2021 -Register   & save



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise