MagnaChip Announces Cost Competitive 0.13 micron Slim Flash Process Technology

SEOUL, South Korea and SAN JOSE, Calif., Oct. 3, 2016 — (PRNewswire) —  MagnaChip Semiconductor Corporation ("MagnaChip") (NYSE: MX), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, announced today the availability of a new 0.13 micron Slim Flash process technology, based on 0.13 micron EEPROM.  While maintaining the same performance characteristics of the existing EEPROM process, Slim Flash process technology is highly cost competitive because it reduces the number of layers to be embedded by 20 percent and cuts the manufacturing turnaround time by 15 percent.

The embedded NVM (Non-Volatile Memory) EEPROM process, integrates logic, analog, and memory into one chip, and has been adopted in a wide range of applications such as automotive, MCU, touch IC and Auto Focus IC.

Qualification test for 0.13 micron Slim Flash process technology was completed in both device performance and yield categories.  All devices passed the WLR (Wafer Level Reliability) test, SRAM, and reliability test of standard cell library.  In particular, high density EEPROM IP satisfied all categories related to endurance and data retention test.

In addition to the existing 0.13 micron EEPROM, MagnaChip plans to build a Slim Flash portfolio by merging Slim Flash into various technologies, including BCD and High Voltage.  MagnaChip is currently engaging with customers using the new technology, with several products currently in development. Volume production of the Slim Flash process technology is expected to begin as early as the fourth quarter of 2016.

"With the introduction of our 0.13 micron Slim Flash process technology, customers now have access to a cost-saving and time-saving manufacturing process that will improve their overall time to market," said YJ Kim, Chief Executive Officer of MagnaChip.

About MagnaChip Semiconductor Corporation

MagnaChip is a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high-volume consumer, communication, industrial and computing applications. The Company's Display Solutions, Power Solutions, and Foundry Services Groups provide a broad range of standard products and manufacturing services to customers worldwide.  MagnaChip owns a portfolio of more than 3,500 registered and pending patents, and has extensive engineering, design and manufacturing process expertise resulting from its 30-year operating history.

For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip's website is not a part of, and is not incorporated into, this release.

CONTACTS:


In the United States:

Bruce Entin

Entin Consulting

Tel. +1-408-625-1262

Email Contact

In Korea:

Chankeun Park

Director of Public Relations

Tel. +82-2-6903-3195

Email Contact

To view the original version on PR Newswire, visit: http://www.prnewswire.com/news-releases/magnachip-announces-cost-competitive-013-micron-slim-flash-process-technology-300337369.html

SOURCE MagnaChip Semiconductor Corporation

Contact:
MagnaChip Semiconductor Corporation
Web: http://www.magnachip.com




Review Article Be the first to review this article
Featured Video
Latest Blog Posts
The Open Geospatial Consortium BlogThe OGC Blog
by The Open Geospatial Consortium Blog
Sponsorship Opportunities for the OGC Climate Change Services 2022 Pilot
Jobs
Assistant Professor in Applied GIS for University of San Diego at San Diego, California
GIS Specialist for Schneider Geospatial at Indianapolis, Indiana
ASIC Architects and Hardware Engineers at D. E. Shaw Research for D. E. Shaw Research at New York, New York
Director, Industrial Machinery Solutions- SISW PLM for Siemens AG at Livonia, Michigan
Senior Highway Engineer for RS&H at Jacksonville, Florida
Product Design Engineer - Softgoods for Apple Inc at Cupertino, California
Upcoming Events
GIS-Pro 2021: URISA's 59th Annual Conference at 701 Lee St #960 Des Plaines IL - Oct 3 - 6, 2021
Autodesk University 2021 | Free digital conference at United States - Oct 5 - 14, 2021
IEC 61850 Week 2021 at United Kingdom - Oct 18 - 22, 2021
Geospatial World Forum 2021 at Amsterdam Netherlands - Oct 20 - 22, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise