Ten Millionth ASIC Shipped Demonstrates A Growing Need For A Fast Time to Market and Low Cost Silicon Customization Product
Santa Clara, CA – July 31st, 2014 –- eASIC Corporation, a leading provider of Single Mask Adaptable ASIC™ devices today announced that it has shipped over ten million chips to date. The majority of the shipments are utilized in some of the fastest growing and dynamic markets. eASIC chips can be found in a variety of applications such as NAND Flash controllers, LTE and 3G radio heads, mobile wireless backhaul systems plus many others.
“eASIC has become the go-to provider for fast time to market, cost effective, mass customization ASIC devices”, said Ronnie Vasishta, President and CEO of eASIC. “This milestone demonstrates that the need for our product has been building quickly and continues to expand deeply and broadly. The alternatives that have been around for over two decades, ASIC and FPGA are no longer able to meet the needs for many high growth applications.”
“Power and performance are key constraints for many of today’s fastest-growing electronics markets. Cloud storage, wireless infrastructure and solid-state/hybrid hard drives and other applications need to balance these attributes against total cost-of-ownership and time to market, often a very challenging high-wire act.” said Jordan Selburn, Senior Principal Analyst at IHS. “In these type of systems, structured ASICs are increasingly able to provide an optimal combination of qualities outside the reach of silicon architectures such as FPGAs.”
eASIC is a fabless semiconductor company offering breakthrough single mask ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.
Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Seagate Technology and Evergreen Partners. For more information on eASIC please visit www.easic.com.
eASIC is a trademark of eASIC Corporation and registered in the U.S. Patent and Trademark Office.
Forward Looking Statements
This press release contains forward-looking statements, including, without limitation, statements related to eASIC’s future sales and distribution of its single mask ASIC devices. Works such as “expects” and similar expressions are intended to identify forward-looking statements. These forward-looking statements are based upon eASIC’s current expectations. Forward-looking statements involve risks and uncertainties. The company’s actual results and the timing of events could differ materially from those anticipated in such forward-looking statements as a result of these risks and uncertainties, which include, without limitation, economic conditions, customer business environment and inventory levels, government and technological factors outside of our control, adoption and roll-out of products, risks related to ability to capitalize on growth opportunities and markets, risks related to our ability to manage our growth and other risks that may cause our business, industry, strategy or actual results to differ materially from the forward-looking statements. eASIC expressly disclaims any obligation or undertaking to release publicly any updates or revisions to any forward-looking statements contained herein.