“What Comes Next?” — Latest Technology Breakthroughs Featured at SEMICON West, July 8-10

SAN JOSE, Calif. — June 26, 2014 — The latest manufacturing, materials and production developments for emerging and adjacent markets will be featured at SEMICON West 2014 ( www.semiconwest.org), to be held on July 8-10 at the Moscone Center in San Francisco, Calif. The co-location of emerging and adjacent market focused exhibitors and technical presentations within the framework of SEMICON West maximizes the synergies between semiconductors and related markets, as each shares many of the same manufacturing materials, equipment, and processes. Over 200 exhibitors and 20 hours of technical presentations will focus on these emerging and adjacent markets, with leading manufacturers, experts and scientists presenting the latest, and answering the question “What comes next?” 

Emerging and adjacent technology sessions at SEMICON West include:

  • Next Generation MEMS (July 8, 10:30am-12:30pm,TechXPOT South) —The expanding range of mobile devices, wearables, and smart objects in the Internet of Things (IoT)  has increased demand for smaller, smarter, lower power devices — developments that have stimulated a recent surge of innovation in MEMS technologies.  Speakers from GE Global Research, NIST, Qualcomm Ventures, Silex Microsystems, Si-Ware, SolMateS, Yole Développement will address the latest trends and developments. Panel moderated by MEMS technologist Eric Pabo of EVG.
  • Bringing Silicon Photonics to Market (July 9, 10:30am-12:30pm, TechXPOT North) — As the increase of connected technologies and growth of Big Data demand increasing bandwidth and transmission speeds, data centers are turning to photons instead of electrons to send data faster between servers, in addition to how to make these high-speed photonic connections between chips. But developing volume manufacturing technology for connecting optics to electronics is complicated, yet critical for wide adoption. This session features experts in photonics from the industry leaders, including Aurrion, Cisco Systems, CEA-Leti, Compass EOS, IBM, Luxtera, and Oracle.
  • Breakthrough Research Technologies (July 10, 1:30-3:30, TechXPOT South) —  Accelerating technology advances increasingly involves not only players in the industry supply chain but university and research institutions. This session showcases the latest innovations and research from collaborative efforts of universities, industries and consortiums.  Hear from Arizona State University, Georgia Institute of Technology, Lam Research (joint project with KU Leuven and imec), Oregon State University, Tokyo Electron (in collaboration with Illinois, Iowa, Michigan, Tohoku and Keio Universities), and University of Washington.
  • 3D Printing:  Science Fiction or the Next Industrial Revolution (July 10, 10:30am-12:30pm, TechXPOT South) —Industry experts explore how 3D printing can benefit manufacturers and how it will impact the 3D printing supply chain. Speakers include: Lawrence Livermore National Labs, Microfabrica, Protocafe, Rabbit Proto, and Semico Research.  Session partner: SEMICO Research.
  • Flexible Hybrid Electronics for Wearable Applications: Challenges and Solutions — (July 10, 10:00am-4:30pm, Marriott Marquis) — This session, presented by SEMI’s partner FlexTech Alliance,  explores next-generation packaging technologies of Flexible Hybrid Electronics (FHE) that combine the high-performance of conventional silicon semiconductors with the innovations in low-cost, flexible packaging from the emerging printed electronics sector.  Speakers from American Semiconductor, Applied Materials, FlexTech Alliance, MonolithIC 3D, Northfield Automation Systems, PARC, Qualcomm, Soligie, Terepac, and more will examine the latest developments.
  • Disruptive Compound Semiconductor Technologies (July 10, 10:30am-12:30pm, TechXPOT North):The huge potential for both wide- and narrow-bandgap compound semiconductor devices will depend on the development of cost-effective volume manufacturing technology. In this session, speakers from: Fraunhofer IZM, KLA-Tencor, Qualcomm, SEMI, Texas Instruments, Transphorm, TriQuint, U.S. Department of Energy, and Yole Developpement present.
  • Semiconductor Technology Symposium (July 8-10, times vary; North Hall, Hall E, Rooms 120/131): Many sessions address the key issues driving the future of semiconductor manufacturing and markets.

Premier sponsors of SEMICON West 2014 include: Applied Materials, KLA-Tencor, and Lam Research.

For more information on SEMICON West, visit  www.semiconwest.org

About SEMICON West

SEMICON West is the flagship annual event for the global microelectronics industry, showcasing the people, products, and technologies driving the design and manufacture of advanced microelectronics. The event attracts the world's leading technology companies serving the microelectronics supply chain and the largest audience of influential buyers, industry leaders, decision-makers, technologists, analysts, and media of any industry event in North America. SEMICON West 2014 is projected to bring together more than 27,000 international attendees, more than 700 global companies, and feature 60+ hours of technical, business, and networking programs. For more information, visit  www.semiconwest.org.  

About SEMI

SEMI is the global industry association serving the nano- and micro-electronic manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C.  For more information, visit  www.semi.org.

Association Contact

Deborah Geiger/SEMI
Phone: 1.408.943.7988
Email:  Email Contact

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