SAN FRANCISCO & SAN JOSE, Calif. — (BUSINESS WIRE) — June 2, 2014 — Silicon Integration Initiative:
What: There will be a panel focused on 3D design standards entitled “Design for 3D: Are Standards Leading the Way or Lagging Behind?” Panelists include: Riko Radojcic from Qualcomm, Karthik Chandrasekar from Altera, Sitaram Arkagud from Invensas, Herb Reiter from eda2asic Consulting, and Sotiris Bantas from Helic. John Ellis from Si2 will moderate the discussion.
When/Where: The 3D Panel will be held on Monday, June 2, at 3:00PM, in Room 300 of the Moscone Convention Center, San Francisco, during the Design Automation Conference (DAC).
Abstract: Adoption of 3D Integrated Circuits for high-volume production may lag the semiconductor industry’s original expectations, but the interest and the technology’s potential are still high. In some areas, standards have been far ahead of the adoption curve, however, in others, particularly in the area of interoperability standards for design automation, concern about standards being in place at the appropriate time has been voiced. What is the true state of interoperability standards for 2.5 and 3D design automation? In this panel discussion, leaders from Si2’s Open3D Technology Advisory Board and experts from industry will discuss development of new standards and what progress still needs to be made. Further information can be found at: http://www.si2.org/dac_2014/abstracts/3dpanel_abstract.php
Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured. Now in its 26th year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents over 100 companies involved in all parts of the silicon supply chain throughout the world. http://www.si2.org/si2_home.php
Silicon Integration Initiative
William Bayer, 512-342-2244, ext. 304