Moortec Semiconductor Announces Industry Leading, High Accuracy On-Chip Temperature Sensor Range for Advanced Nodes

Plymouth, UK (11th Nov 2013) – Moortec Semiconductor Limited, provider of analog and mixed-signal IP solutions, announces its range of high accuracy on-chip temperature sensors for advanced CMOS technologies. This latest range extends Moortec's position as a leading provider of embedded thermal sensors to semiconductor customers worldwide. With an uncalibrated accuracy of +/-3C and a calibrated accuracy of +/-1C, across the temperature range of -40C to 125C, the new range also offers a resolution of 0.06C. The new IP range will allow for the performance of individual Integrated Circuit (IC) designs to be monitored and enhanced dynamically to a higher accuracy. Therefore, helping large scale System on Chip (SoC) designs to better manage the internal heating issues seen on advanced node semiconductor devices due to the higher gate densities, hence higher power densities, that can now be manufactured.

Applications for the sensor include performance optimisation schemes such as Dynamic Voltage and Frequency Scaling (DVFS), thermal monitoring to create alarm conditions and also device security against hacking. Another application is the monitoring of on-chip junction temperature, which with the higher accuracy now offered by Moortec, will allow for improved monitoring during the High Temperature Operating Life (HTOL) test phase, often required for the qualification and characterisation of silicon devices. Although the sensor IP is predominantly analog in design, the digital interfacing and standard CMOS process option compatibility make it easy to integrate within any digital implementation flow. Optional extra digital interfaces are provided with Moortec's IP range, such as AMBA APB, I2C, SPI and iJTAG to help customers access the sensors via their microprocessor cores, access the sensors from off-chip as part of a power management strategy or provide sensor access during test.

"Moortec believe there is now a critical need for reliable on-chip monitoring, especially thermal monitoring, for semiconductor geometries of 28-nanometer (nm), 16nm and 14nm," said Stephen Crosher, Managing Director of Moortec Semiconductor. “As transistor geometries shrink and both gate and power densities per unit area increase, designers are having to deal with the thermal effects of overheating and poor system performance, hence they are seeking ways in which their designs can be optimised dynamically," Crosher continued to add. "Our enhanced accuracy temperature sensor range, available on TSMC28LP and TSMC28HPM technology nodes in Q4 2013, enables temperature dependant clock-throttling schemes to be implemented on a per device basis, allowing for individual device performance optimisation. Thermal issues are here to stay and where devices using 28nm planar CMOS technologies suffer from high leakage currents which contributes to issues such as thermal runaway, we are also seeing FinFET and FDSOI technologies exhibit their own problems due to the increased logic densities, and hence power densities, that can now be achieved.

Moortec, also offer on-chip Voltage Monitoring IP for both steady state supply measurements as well as glitch detection to customers world-wide. To provide the complete on-chip PVT monitoring solution, Moortec are currently developing their Process Detector IP for delivery in Q1 2014. With each block, optionally provided with extended digital interfacing, their next step is to extend their range to include integrated PVT die-monitoring modules, DVFS sub-systems and make available their IP product range on leading edge FinFET technologies.

See for more information on Moortec's Embedded PVT Monitoring solutions.

About Moortec Semiconductor

Moortec Semiconductor, established in 2005, provide high quality analog and mixed-signal IP blocks as well as Custom Chip solutions world-wide for a variety of applications. Having a track record of delivery to tier-1 semiconductor and product companies, Moortec provide a quick and efficient path to market for customer products and innovations. For information please visit

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