DRESDEN, Germany — 17 September 2013 — With the proliferation of packaging and test events worldwide, choosing the right conference to attend is critical. If learning the latest news on technologies from leading-edge companies is your key criteria, the best choices include the Advanced Packaging Conference (APC) and the 15th European Manufacturing Test Conference (EMTC) during SEMICON Europa ( www.semiconeuropa.org) on 8-10 October.
The Advanced Packaging Conference will feature two keynotes presentations from the #1 Fabless and the #1 OSAT in the world. Ho-Ming Tong, GM and chief R&D officer of ASE Group, and Steve Bezuk, senior director of Qualcomm, will present at the 2013 conference themed “The Power of Packaging.” The conference will cover aspects of Power Handling, Size, Interconnection Interfaces, Thermal Management, and Heat Dissipation. Wafer-Level Packaging and 3D Packaging will be addressed as well. The APC program will shed light on recent application-specific packaging technologies, processing and manufacturing related technologies which can be leveraged as key enablers for cost-efficient electronic devices and systems. The conference will provide a unique opportunity to learn more about new developments, package technologies, applications and package solutions for various products used in power applications and system integration. The speaker “line up” is impressive, with representatives of companies such as Robert Bosch, STMicroelectronics, GLOBALFOUNDRIES, Nanium, SPIL, Yole Developpement, and more.
If test is more critical to your job, attend an interactive event combining keynotes, regular presentations and panel discussions — the 15th European Manufacturing Test Conference is entitled “Semiconductor Test: A Reactive or Proactive Industry?” The event will include both Future Horizons and VLSI Research delivering keynote presentations. Malcolm Penn, CEO of Future Horizons, will share his controversial views in a presentation called, “Last Stop before Invoicing … No Pressure, Just Ship!” Risto Puhakka, president of VLSI Research, will describe the market and the opportunities ahead in a presentation called “The Technology and Market Forces Shaping the Future of Test.
The first day at EMTC concludes with a panel debating the issue "Is Test Becoming a Commodity?" which takes a critical look at whether the test industry in Europe is a leader or follower of other semiconductor market segments. On the second day of the event, the panel discussion will discuss “How do we leverage EU leadership in MEMS test into other areas?” The EMTC focuses on (Design for) Test Technologies, Approaches and Equipment that are being developed in Europe and elsewhere. Attendance for this conference is “a must” for Product and Test Engineers, as well as for their managers. As the conference also discusses breakthrough methodologies which impacts Test Operations, test-fab managers and decision makers also should attend and participate.
SEMICON Europa ( www.semiconeuropa.org) is the leading exhibition and conference dedicated to the future of micro- and nanoelectronics design and manufacturing in Europe. Leading companies will exhibit and showcase the latest equipment, materials, software and solutions and over 100 speakers will share information on the latest trends, technologies, processes and techniques in electronic applications, design and manufacturing. SEMICON Europa will be held on 8-10 October 2013 in conjunction with the Plastics Electronics Conference and Exhibition ( www.plastic-electronics.org) to showcase Europe’s most innovative companies, research institutes, and professionals.
SEMI is the global industry association serving the nano- and microelectronic manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit
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