Molex Introduces LGA 2011-0 CPU Socket Supporting Top-of-the-Line Intel Core* i7 Series Processors

Intel-approved LGA 2011-0 CPU socket meets reliability requirements for target processor performance levels of servers, workstations and high-end PCs

LISLE, Ill. — (BUSINESS WIRE) — December 11, 2012Molex Incorporated has augmented its CPU solutions with the launch of an Intel-approved LGA 2011-0 CPU socket for the Intel Core* i7 series of 32nm-Sandy Bridge-E microprocessors. Designed to handle 130W Thermal Design Power (TDP), the LGA 2011-0 socket replaces the LGA 1366 CPU socket, which was used with the Intel Core i7-930, i7-950, i7-960, i7-980 and i7-990X processors.

“The new LGA 2011-0 socket delivers the improved electrical, mechanical and thermal reliability needed to achieve target performance levels of Intel Core i7-3930K, i7-3820 and i7-3960K Extreme Edition processors used in enterprise servers, workstations and high-end PCs,” states Carol Liang, global product manager, Molex. “A higher pin-count and the greater contact density of the compact LGA 2011 socket make it ideal to support the condensed package—and powerful features of Intel 2nd generation, top-of-the-line Core i7 series processors in breakthrough performance applications.”

An innovative fully-loaded interstitial seating plane (ISP) design improves contact reliability of the Molex LGA 2011-0 socket by preventing circuit opens and shorts caused by contact deformation during a package overload. The LGA 2011-0 socket is compatible with a Standard (Square) and a Narrow ILM design assembly. The Standard ILM has a larger (80x80mm) keep-out zone than the Narrow ILM (56x94mm). The LGA 2011-0 socket is not backward compatible for use with any other processors and their ILM assemblies.

“The unique ISP design of the LGA 2011-0 socket minimizes risk of electrical shorting during processor overloads—protecting the investment of users who depend on higher system and operation reliability,” adds Liang.

The LGA 2011-0 CPU socket uses high strength, copper alloy contacts for robust performance. Socket terminals are oriented at angles that reduce the risk of cross-contact during processor overloads. Molex also offers 15 or 30 micron gold-plated contact sockets with pick-and-place covers for easy placement in automated board assembly. All sockets are shipped in JEDEC-type hard trays.

For additional information visit: www.molex.com/link/lga2011.html. To receive information on other Molex products and industry solutions, please sign up for our e-nouncement newsletter at http://www.molex.com/link/register/.

About Molex Incorporated

Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including data communications, telecommunications, consumer electronics, industrial, automotive, medical, military and lighting. Established in 1938, the company operates 40 manufacturing locations in 16 countries. The Molex website is http://www.molex.com. Follow us at http://www.twitter.com/molexconnectors watch our videos at http://www.youtube.com/molexconnectors, connect with us at http://www.facebook.com/molexconnectors and read our blog at http://www.connector.com.

* Intel Core is a trademark of Intel Coporation.

Molex is a registered trademark of Molex Incorporated



Contact:

FOR EDITORIAL INFORMATION
Christa Carroll
Outlook Marketing Services
630-922-6995
Email Contact
or
Larry Wegner
Molex Incorporated
630-527-2650
Email Contact




Review Article Be the first to review this article


Featured Video
Latest Blog Posts
Jim SparksGISCafe Guest
by Jim Sparks
Maps are (Still) Important Again
Jobs
Applications Programmer Analyst I for Southern Nevada Health District at Las Vegas, Nevada
Applications Programmer Analyst II for Southern Nevada Health District at Las Vegas, Nevada
GIS Project Manager for VHB at Wethersfield, Connecticut
Upcoming Events
Smart GEO Expo 2020 at COEX Hall C Republic of Korea Seoul Korea (South) - Aug 19 - 21, 2020
Defense Services Asia (DSA) 2020 at Kuala Lumpur Malaysia - Aug 24 - 27, 2020
IWCE 2020 Conference at Las Vegas Convention Center LAS VEGAS NV - Aug 24 - 28, 2020
ENVI Analytics Symposium (Virtual EAS) at CO - Aug 25 - 27, 2020
University of Denver GIS Masters Degree Online
UAV Expo2020 -Register   & save



© 2020 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise